型号:

583861-5

RoHS:无铅 / 符合
制造商:TE Connectivity描述:CONN HOUSING CARDEDGE 6DL POS
详细参数
数值
产品分类 连接器,互连式 >> 卡边缘 - 外壳
583861-5 PDF
RoHS指令信息 583861-5 Statement of Compliance
标准包装 2,000
系列 TWIN LEAF
卡类型 非指定 - 双边
位置数 12
卡厚度 0.055" ~ 0.070"(1.40mm ~ 1.78mm)
间距 0.100"(2.54mm)
特点 法兰
安装类型 面板安装
颜色
法兰特点 顶部安装开口,无螺纹,0.128"(3.25mm)直径
材料 - 绝缘体 热塑性聚酯,玻璃纤维增强型
包装 散装
请注意 不提供触点
材料可燃性额定值 UL94 V-0
工作温度 -40°C ~ 85°C
相关产品 583879-4-ND - CONN CONT 15AU CRIMP TWIN LEAF
583854-5-ND - CONN CONTACT SOLDER EYELET GOLD
A100671TR-ND - CONN CONTACT 28-24AWG CRIMP GOLD
583616-5-ND - CONN CONTACT 28-24AWG CRIMP GOLD
531477-4-ND - CONN TWIN LEAF 24-20AWG CRIMP
1-583853-0-ND - CONTACT CRIMP 24-20AWG .100-.156
1-583616-0-ND - CONTACT CRIMP 28-24AWG .100-.156
1-583853-1-ND - CONN CONTACT TWIN LEAF 20-24AWG
583853-9-ND - CONN CONTACT 24-20AWG 50GOLD
583853-5-ND - CONN CONTACT 24-20AWG 30GOLD
更多...
相关参数
583717-1 TE Connectivity CONN CARD EDGE 10 POS .100
SX1506I091TRT Semtech IC GPIO EXP I2C 16CH 28UTQFN
0009016038 Molex Inc CONN CARD EDGE HOUSING 3POS
ATTINY5-MAHR Atmel IC MCU AVR 512B FLASH 8UDFN
530521-6 TE Connectivity HIGH CURRENT HSG 8 POS
531271-1 TE Connectivity CONN HOUSING 15 POS W/MOUNT EARS
SX1506I091TRT Semtech IC GPIO EXP I2C 16CH 28UTQFN
ATTINY4-MAHR Atmel IC MCU AVR 512B FLASH 8UDFN
583859-1 TE Connectivity CONN CARDEDGE HSNG 28POS DL .156
PCA9554ADB,112 NXP Semiconductors IC I/O EXPANDER I2C 8B 16SSOP
ATTINY4-MAHR Atmel IC MCU AVR 512B FLASH 8UDFN
ATTINY5-TS8R Atmel IC MCU AVR 512B FLASH SOT-23-6
PCA9554ADB,118 NXP Semiconductors IC I/O EXPANDER I2C 8B 16SSOP
1-583861-1 TE Connectivity TW-LEAF CRP. HSG 17 POS. 100 C
PCA9554ADB,118 NXP Semiconductors IC I/O EXPANDER I2C 8B 16SSOP
ATTINY5-TS8R Atmel IC MCU AVR 512B FLASH SOT-23-6
2-583718-7 TE Connectivity CONN HOUSING 32POS .100 BLACK
PCA9554ADB,118 NXP Semiconductors IC I/O EXPANDER I2C 8B 16SSOP
583299-1 TE Connectivity CONN CARDEDGE HOUSING 10POS .156
ATTINY9-TS8R Atmel IC MCU AVR 1KB FLASH SOT-23-6